ASML, Intel, TSMC, and Samsung Partner to Transition to 12-Inch EUV Photomasks

On September 8, 2026, Dutch semiconductor equipment maker ASML announced joint agreements with leading global chipmakers, including TSMC, Intel Foundry, and Samsung Electronics, to transition from the industry's long-standing 6-inch photomask standard to a larger 12-inch format for High NA EUV lithography systems. The strategic shift addresses physical and thermal constraints inherent in traditional 6-inch photomask designs, which limit the physical size and complexity of advanced logic and memory microchips. According to technical specifications released by ASML, moving to 12-inch photomasks will boost lithography system productivity by up to 40 percent, allowing manufacturers to print significantly finer, higher-density circuit patterns essential for next-generation artificial intelligence accelerators. Among the partners, Samsung Electronics plans to introduce 12-inch EUV photomasks into its high-volume DRAM memory chip manufacturing by 2028. Meanwhile, Taiwan Semiconductor Manufacturing Co. (TSMC) has outlined a formal roadmap targeting full-scale commercial implementation by 2030. Industry analysts view the joint commitment as a critical technological milestone that provides clear long-term visibility for semiconductor scaling as global demand for AI infrastructure continues to surge.